Applications

■Verification of thermal design of power modules

Temperature measurement of semiconductor power module can be achieved at the component level during the actual operation. Temperature of small components can be easily measured.
＞＞Merits of introducing this system
  • Temperature measurement of small components at the components level and verification of thermal design.

Typical models

Adhesive Type Temperature Sensors
ST-50

  • Easy to measure temperature by sticking the sensor onto the small object.
  • Fast response. Suitable for collecting temperature profile.
  • Sensor with bare end cable is available, which is suitable for using a cable clamp.